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IC-HKBMSOP8-TP

LASER COMPONENTS GMBH

LASER COMPONENTS GMBH IC-HKBMSOP8-TP
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    INTERFACE CIRCUIT
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP8,.19
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -25

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IC-HKBMSOP8-TP
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IC-HKBMSOP8-TP