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IBM3209K3114

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM3209K3114
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    24.735
  • Length (mm)
    24.735
  • JESD-30 Code
    S-CBGA-B360
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    360
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    6.3
  • Supply Voltage-Nom (V)
    2.5
  • Package Equivalence Code
    BGA360,19X19,50
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    0

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IBM3209K3114
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IBM3209K3114