ProductsManufacturers
Events
Send an RFQBOM Tool

IBM3009K2672

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM3009K2672
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    25
  • Length (mm)
    32.5
  • JESD-30 Code
    R-CBGA-B474
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Telecom IC Type
    FRAMER
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    474
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    5.9
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    1.34
  • Package Equivalence Code
    BGA474,19X25,50
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for IBM3009K2672

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IBM3009K2672
Send an RFQ
IBM3009K2672