ProductsManufacturers
Events
Send an RFQBOM Tool

IBM25PPC750CXEJP2023T

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM25PPC750CXEJP2023T
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • Speed (MHz)
    400
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    LBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.666
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA256,20X20,50
  • Clock Frequency-Max (MHz)
    133
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC

0 suppliers available to buy or to bid for IBM25PPC750CXEJP2023T

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IBM25PPC750CXEJP2023T
Send an RFQ
IBM25PPC750CXEJP2023T