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IBM25CPC700BB3B83

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM25CPC700BB3B83
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    25
  • Length (mm)
    32.5
  • JESD-30 Code
    R-CBGA-B474
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    32
  • Bus Compatibility
    POWERPC 60X; POWERPC 7XX
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    474
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.05
  • Supply Voltage-Max (V)
    3.465
  • Supply Voltage-Min (V)
    3.135
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA474,19X25,50
  • Clock Frequency-Max (MHz)
    83.33
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40

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IBM25CPC700BB3B83