ProductsManufacturers
Events
Send an RFQBOM Tool

IBM04368CXLBC-25

IBM MICROELECTRONICS

IBM MICROELECTRONICS IBM04368CXLBC-25
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B153
  • Memory Width
    36
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Memory Organization
    256KX36
  • Number of Functions
    1
  • Number of Terminals
    153
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    1.8
  • Number of Words Code
    256K
  • Memory Density (bits)
    9437184
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    2.679
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    262144
  • Standby Current-Max (A)
    0.15
  • Standby Voltage-Min (V)
    2.38
  • Supply Current-Max (mA)
    750
  • Package Equivalence Code
    BGA153,9X17,50
  • Clock Frequency-Max (MHz)
    400
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for IBM04368CXLBC-25

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
IBM04368CXLBC-25
Send an RFQ
IBM04368CXLBC-25