HY82563EB by Intel Corporation | Sourcengine

Intel Corporation HY82563EB

Lifecycle status
Discontinued
RoHS
RoHS compliant
REACH
REACH compliant
Description
Interface Circuit, 2-Trnsvr, PQFP100
Category
Semiconductors Telecom ICs Network Interfaces INTERFACE CIRCUIT

ECCN
5A991
ECCN Governance
EAR
HTS Code
8542.31.00.01
SB Code
8542.31.00.00

Width
14 mm
Length
14 mm
Data Rate
1000 Mbps
JESD-30 Code
S-PQFP-G100
Package Code
HTFQFP
JESD-609 Code
e3
Package Shape
SQUARE
Package Style
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Telecom IC Type
INTERFACE CIRCUIT
Terminal Finish
MATTE TIN
Seated Height-Max
1.2 mm
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Supply Voltage-Nom
3.3 V
Number of Functions
1
Number of Terminals
100
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Number of Transceivers
2
Package Equivalence Code
TQFP100,.63SQ
Operating Temperature-Max
60 Cel
Operating Temperature-Min
0 Cel