ProductsManufacturers
Events
Send an RFQBOM Tool

HY5PS56821AFP-E3

SK Hynix

SK Hynix HY5PS56821AFP-E3
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.24
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B60
  • Memory Width
    8
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    DDR2 DRAM
  • Refresh Cycles
    8192
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Memory Organization
    32MX8
  • Number of Terminals
    60
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    0.6
  • Number of Words Code
    32M
  • Memory Density (bits)
    268435456
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    33554432
  • Sequential Burst Length
    4,8
  • Interleaved Burst Length
    4,8
  • Package Equivalence Code
    BGA60,9X11,32
  • Clock Frequency-Max (MHz)
    200
  • Operating Temperature-Max (Cel)
    95
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for HY5PS56821AFP-E3

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HY5PS56821AFP-E3
Send an RFQ
HY5PS56821AFP-E3