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HY27US08121M-FPCS

SK Hynix

SK Hynix HY27US08121M-FPCS
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    SLC NAND TYPE
  • Width
    8.5 mm
  • Length
    15 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B68
  • Memory Width
    8
  • Organization
    64MX8
  • Package Code
    BGA
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    536870912 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    12000 ns
  • Number of Words
    67108864 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    68
  • Programming Voltage
    3.3 V
  • Number of Words Code
    64M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

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HY27US08121M-FPCS