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HY23V64200M-100

MAGNACHIP SEMICONDUCTOR LTD

MAGNACHIP SEMICONDUCTOR LTD HY23V64200M-100
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G48
  • Memory Width
    8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1MX8
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    150
  • Number of Words Code
    4M
  • Memory Density (bits)
    8388608
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    4194304
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    35
  • Package Equivalence Code
    TSSOP48,.8,20
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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HY23V64200M-100
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HY23V64200M-100