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HX316LS9IBK2/16

Kingston Technology Company, Inc.

Kingston Technology Company, Inc. HX316LS9IBK2/16
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8473.30.11.40
  • SB Code
    8542.32.00.23
  • Length
    67.6 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-XDMA-N204
  • Memory Width
    64
  • Organization
    1GX64
  • Package Code
    DIMM
  • Self Refresh
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    68719476736 bit
  • Memory IC Type
    DDR3L DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Number of Ports
    1
  • Number of Words
    1073741824 words
  • Seated Height-Max
    30 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Additional Feature
    ALSO OPERATES AT 1.5V ; PROGRAMMABLE CAS LATENCY; SEATED HGT-NOM
  • Number of Functions
    2
  • Number of Terminals
    204
  • Standby Voltage-Min
    1.28 V
  • Number of Words Code
    1G
  • Package Body Material
    UNSPECIFIED
  • Sequential Burst Length
    4,8
  • Interleaved Burst Length
    4,8
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Supply Voltage-Min (Vsup)
    1.28 V
  • Supply Voltage-Nom (Vsup)
    1.35 V

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HX316LS9IBK2/16