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HWD2190IBL

CHENGDU SINO MICROELECTRONICS TECHNOLOGY CO LTD

CHENGDU SINO MICROELECTRONICS TECHNOLOGY CO LTD HWD2190IBL
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • JESD-30 Code
    S-PBGA-B9
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    0.5 mm
  • Consumer IC Type
    AUDIO AMPLIFIER
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    10 mA
  • Number of Functions
    1
  • Number of Terminals
    9
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA9,3X3,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel

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HWD2190IBL
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HWD2190IBL