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HU82564EB

Intel Corporation

Intel Corporation HU82564EB
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    14
  • Length (mm)
    14
  • JESD-30 Code
    S-PQFP-G100
  • Package Code
    HTFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Telecom IC Type
    INTERFACE CIRCUIT
  • Terminal Finish
    TIN LEAD
  • Data Rate (Mbps)
    1000
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Number of Transceivers
    1
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    TQFP100,.63SQ
  • Operating Temperature-Max (Cel)
    60
  • Operating Temperature-Min (Cel)
    0

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HU82564EB
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HU82564EB