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HPA02273ZQLR

Texas Instruments Incorporated

Texas Instruments Incorporated HPA02273ZQLR
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    4.5
  • Length (mm)
    7
  • JESD-30 Code
    R-PBGA-B56
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Output Polarity
    COMPLEMENTARY
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Interface IC Type
    LINE DRIVER
  • Out Swing-Min (V)
    0.25
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Interface Standard
    GENERAL PURPOSE
  • Differential Output
    YES
  • Number of Functions
    4
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    0.65
  • Driver Number of Bits
    4
  • Input Characteristics
    STANDARD
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    DIFFERENTIAL
  • Seated Height-Max (mm)
    1
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.8
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    55.1
  • Supply Voltage1-Max (V)
    3.6
  • Supply Voltage1-Min (V)
    3
  • Supply Voltage1-Nom (V)
    3.3
  • Package Equivalence Code
    BGA56,6X10,25
  • Moisture Sensitivity Level
    2
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -10
  • Time@Peak Reflow Temperature-Max (s)
    30

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HPA02273ZQLR