ProductsManufacturers
Events
Send an RFQBOM Tool

HN62444BP

Renesas Technology Corp.

HN62444BP Datasheet
Renesas Technology Corp. HN62444BP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    52.8
  • JESD-30 Code
    R-PDIP-T40
  • Memory Width
    16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    MASK ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    100
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for HN62444BP

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HN62444BP
Send an RFQ
HN62444BP