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HN27C256AG-10

Renesas Technology Corp.

HN27C256AG-10 Datasheet
Renesas Technology Corp. HN27C256AG-10
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Width
    15.24
  • Length
    36.83
  • Technology
    CMOS
  • JESD-30 Code
    R-GDIP-T28
  • Memory Width
    8
  • Organization
    32KX8
  • Package Code
    WDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, WINDOW
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144
  • Memory IC Type
    UVPROM
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    2.54
  • Access Time-Max
    100
  • Number of Words
    32768
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    5.89
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    28
  • Number of Words Code
    32K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Operating Temperature-Max
    70
  • Operating Temperature-Min
    0
  • Supply Voltage-Max (Vsup)
    5.5
  • Supply Voltage-Min (Vsup)
    4.5
  • Supply Voltage-Nom (Vsup)
    5

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HN27C256AG-10
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HN27C256AG-10