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HM9-7687RP5

HARRIS SEMICONDUCTOR

HARRIS SEMICONDUCTOR HM9-7687RP5
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    R-XDFP-F20
  • Memory Width
    4
  • Organization
    2KX4
  • Package Code
    DFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    8192 bit
  • Memory IC Type
    OTP ROM
  • Terminal Pitch
    1.27 mm
  • Number of Words
    2048 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    20
  • Number of Words Code
    2K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    FL20,.3
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel

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HM9-7687RP5
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HM9-7687RP5