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HM9-6661-2

Intersil Corporation

Intersil Corporation HM9-6661-2
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-XDFP-F18
  • Memory Width
    4
  • Organization
    256X4
  • Package Code
    DFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    1024 bit
  • Memory IC Type
    OTP ROM
  • Terminal Pitch
    1.27 mm
  • Number of Words
    256 words
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Terminals
    18
  • Number of Words Code
    256
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    FL18,.3
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel

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HM9-6661-2
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HM9-6661-2