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HM9-6561B2

HARRIS SEMICONDUCTOR

HARRIS SEMICONDUCTOR HM9-6561B2
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-XDFP-F18
  • Memory Width
    4
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    256X4
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    220
  • Number of Words Code
    256
  • Memory Density (bits)
    1024
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Number of Words (words)
    256
  • Standby Current-Max (A)
    1.0E-5
  • Standby Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    7
  • Package Equivalence Code
    FL18,.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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HM9-6561B2
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HM9-6561B2