ProductsManufacturers
Events
Send an RFQBOM Tool

HM3-6514B-9+

Intersil Corporation

Intersil Corporation HM3-6514B-9+
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T18
  • Memory Width
    4
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    STANDARD SRAM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1KX4
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    220
  • Number of Words Code
    1K
  • Memory Density (bits)
    4096
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1024
  • Standby Current-Max (A)
    1.5E-5
  • Standby Voltage-Min (V)
    2
  • Supply Current-Max (mA)
    19
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for HM3-6514B-9+

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HM3-6514B-9+
Send an RFQ
HM3-6514B-9+