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HJ93D2010

Renesas Technology Corp.

Renesas Technology Corp. HJ93D2010
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    13
  • Length (mm)
    19
  • JESD-30 Code
    R-PBGA-B273
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Additional Feature
    IT REQUIRES 1.8V SUPPLY FOR 100 MHZ MODELS
  • Number of Terminals
    273
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.9
  • Supply Voltage-Nom (V)
    1.9
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT

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HJ93D2010
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HJ93D2010