ProductsManufacturers
Events
Send an RFQBOM Tool

HH80557KH0362M

Intel Corporation

Intel Corporation HH80557KH0362M
  • ECCN
    3A991.A.1
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Format
    FLOATING POINT
  • Bit Size
    64
  • Technology
    CMOS
  • Width (mm)
    37.5
  • Length (mm)
    37.5
  • Speed (MHz)
    1860
  • JESD-30 Code
    S-PBGA-B775
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • DLA Qualification
    Not Qualified
  • Terminal Position
    BOTTOM
  • Number of Terminals
    775
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4.337
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR

0 suppliers available to buy or to bid for HH80557KH0362M

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HH80557KH0362M
Send an RFQ
HH80557KH0362M