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HD74LVC1G97CLE

Renesas Technology Corp.

Renesas Technology Corp. HD74LVC1G97CLE
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    LVC/LCX/Z
  • Technology
    CMOS
  • Width (mm)
    0.9
  • Length (mm)
    1.4
  • JESD-30 Code
    R-PBGA-B6
  • Package Code
    VFBGA
  • Logic IC Type
    LOGIC CIRCUIT
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Packing Method
    TR
  • Schmitt Trigger
    YES
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    6
  • Terminal Pitch (mm)
    0.5
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.5
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA6,2X3,20
  • Output Low Current-Max (mA)
    24
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    6.3
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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HD74LVC1G97CLE