ProductsManufacturers
Events
Send an RFQBOM Tool

HD74LV1GW16ACME

Renesas Technology Corp.

Renesas Technology Corp. HD74LV1GW16ACME
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    LV/LV-A/LVX/H
  • Technology
    CMOS
  • Width (mm)
    1.25
  • Length (mm)
    2
  • JESD-30 Code
    R-PDSO-G6
  • Package Code
    TSSOP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e6
  • Packing Method
    TR
  • Schmitt Trigger
    NO
  • Terminal Finish
    TIN BISMUTH
  • Number of Inputs
    1
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    6
  • Terminal Pitch (mm)
    0.65
  • Load Capacitance (pF)
    50
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    33
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    TSSOP6,.08
  • Output Low Current-Max (mA)
    6
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Propagation Delay-Max@Nom-Sup (ns)
    12

0 suppliers available to buy or to bid for HD74LV1GW16ACME

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
HD74LV1GW16ACME
Send an RFQ
HD74LV1GW16ACME