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HD64570CP8I

Renesas Technology Corp.

HD64570CP8I Datasheet
Renesas Technology Corp. HD64570CP8I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    29.28
  • Length (mm)
    29.28
  • JESD-30 Code
    S-PQCC-J84
  • Package Code
    QCCJ
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    J BEND
  • Low Power Mode
    NO
  • Address Bus Width
    24
  • Bus Compatibility
    68000; 64180; 8086
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    84
  • Terminal Pitch (mm)
    1.27
  • Number of Serial I/Os
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; X.21; X.25; LAPB; LAPD; DDCMP
  • Seated Height-Max (mm)
    4.6
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    16
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
  • Data Transfer Rate-Max (MBps)
    0.7125
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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HD64570CP8I
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HD64570CP8I