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HD6417750SVBT133

Renesas Technology Corp.

Renesas Technology Corp. HD6417750SVBT133
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FLOATING POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    15
  • Length (mm)
    15
  • Speed (MHz)
    133
  • JESD-30 Code
    S-PBGA-B264
  • Package Code
    LFBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Low Power Mode
    YES
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Integrated Cache
    YES
  • Address Bus Width
    26
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    BOTTOM
  • Number of Terminals
    264
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.4
  • Supply Voltage-Max (V)
    1.7
  • Supply Voltage-Min (V)
    1.4
  • Supply Voltage-Nom (V)
    1.5
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA264,17X17,32
  • Clock Frequency-Max (MHz)
    34
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    75
  • Operating Temperature-Min (Cel)
    -20
  • Time@Peak Reflow Temperature-Max (s)
    20

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HD6417750SVBT133
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HD6417750SVBT133