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HD6417709SBP133V

Renesas Technology Corp.

Renesas Technology Corp. HD6417709SBP133V
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Format
    FIXED-POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    16
  • Length (mm)
    16
  • Speed (MHz)
    133
  • JESD-30 Code
    S-CBGA-B240
  • Package Code
    BGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Address Bus Width
    26
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    240
  • Terminal Pitch (mm)
    1
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    2.05
  • Supply Voltage-Min (V)
    1.65
  • Supply Voltage-Nom (V)
    1.8
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA240,19X19,25
  • Clock Frequency-Max (MHz)
    66.67
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -20

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HD6417709SBP133V
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HD6417709SBP133V