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HC-5570AP

TEMIC SEMICONDUCTORS

TEMIC SEMICONDUCTORS HC-5570AP
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDIP-T28
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Terminal Pitch
    2.54 mm
  • Telecom IC Type
    MODEM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    20 mA
  • Supply Voltage-Nom
    5 V
  • Number of Terminals
    28
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Neg Supply Voltage-Nom
    -5 V
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel

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HC-5570AP
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HC-5570AP