ProductsManufacturers
Events
Send an RFQBOM Tool

H5TQ4G83AFR-TEI

SK Hynix

SK Hynix H5TQ4G83AFR-TEI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    9 mm
  • Length
    11 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B78
  • Memory Width
    8
  • Organization
    512MX8
  • Package Code
    TFBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4294967296 bit
  • Memory IC Type
    DDR3L DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    0.18 ns
  • Number of Ports
    1
  • Number of Words
    536870912 words
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    AUTO/SELF REFRESH
  • Supply Current-Max
    175 mA
  • Number of Functions
    1
  • Number of Terminals
    78
  • Standby Current-Max
    0.011 Amp
  • Number of Words Code
    512M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    4,8
  • Interleaved Burst Length
    4,8
  • Package Equivalence Code
    BGA78,9X13,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Supply Voltage-Min (Vsup)
    1.283 V
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Clock Frequency-Max (fCLK)
    1066 MHz
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for H5TQ4G83AFR-TEI

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
H5TQ4G83AFR-TEI
Send an RFQ
H5TQ4G83AFR-TEI