H5ANAG8NCMR-XNC by SK Hynix | Sourcengine

SK Hynix H5ANAG8NCMR-XNC

Lifecycle status
Contact Mfr
RoHS
RoHS compliant
Description
DRAM Chip DDR4 SDRAM 16Gbit 2Gx8 1.2V 78-Pin FBGA
Category
Semiconductors Memory ICs DRAMs DDR4 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
Width (mm)
7.5
Access Mode
MULTI BANK PAGE BURST
Length (mm)
11
JESD-30 Code
R-PBGA-B78
Memory Width
8
Package Code
TFBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR4 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
AUTO/SELF REFRESH
Memory Organization
2GX8
Number of Functions
1
Number of Terminals
78
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
32
Number of Words Code
2G
Memory Density (bits)
17179869184
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
1.26
Supply Voltage-Min (V)
1.14
Supply Voltage-Nom (V)
1.2
Number of Words (words)
2147483648
Sequential Burst Length
4,8
Standby Current-Max (A)
42
Supply Current-Max (mA)
168
Interleaved Burst Length
4,8
Package Equivalence Code
BGA78,9X13,32
Clock Frequency-Max (MHz)
1600
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0