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H55S1G32MFP-75

SK Hynix

SK Hynix H55S1G32MFP-75
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.32
  • SB Code
    8542.32.00.15
  • Width
    8 mm
  • Length
    13 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    FOUR BANK PAGE BURST
  • JESD-30 Code
    R-XZMA-N200
  • Memory Width
    32
  • Organization
    32MX32
  • Package Code
    FBGA
  • Self Refresh
    YES
  • JESD-609 Code
    e1
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    BALL
  • Memory Density
    1073741824 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    6 ns
  • Number of Ports
    1
  • Number of Words
    33554432 words
  • Terminal Finish
    TIN SILVER COPPER
  • Temperature Grade
    OTHER
  • Terminal Position
    ZIG-ZAG
  • Additional Feature
    AUTO/SELF REFRESH
  • Supply Current-Max
    120 mA
  • Number of Functions
    1
  • Number of Terminals
    90
  • Standby Current-Max
    1.0E-5 Amp
  • Number of Words Code
    32M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Sequential Burst Length
    1,2,4,8,FP
  • Interleaved Burst Length
    1,2,4,8
  • Package Equivalence Code
    BGA90,9X15,32
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -30 Cel
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Clock Frequency-Max (fCLK)
    133 MHz
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    20

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H55S1G32MFP-75
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H55S1G32MFP-75