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GS8673ET18BK-625S

GSI Technology, Inc.

GSI Technology, Inc. GS8673ET18BK-625S
  • ECCN
    3A991.B.2.B
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    14 mm
  • Length
    22 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B260
  • Memory Width
    18
  • Organization
    4MX18
  • Package Code
    HBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    75497472 bit
  • Memory IC Type
    DDR SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Words
    4194304 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    2.3 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    260
  • Number of Words Code
    4M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.4 V
  • Supply Voltage-Min (Vsup)
    1.3 V
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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GS8673ET18BK-625S
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GS8673ET18BK-625S