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GS8642ZV18F-167I

GSI Technology, Inc.

GSI Technology, Inc. GS8642ZV18F-167I
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • Memory Organization
    4MX18
  • Number of Functions
    1
  • Number of Terminals
    165
  • Access Time-Max (ns)
    8
  • Number of Words Code
    4M
  • Memory Density (bits)
    75497472
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    2
  • Supply Voltage-Min (V)
    1.6
  • Supply Voltage-Nom (V)
    1.8
  • Number of Words (words)
    4194304
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    235
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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GS8642ZV18F-167I
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GS8642ZV18F-167I