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GS82583EQ36GK-500

GSI Technology, Inc.

GSI Technology, Inc. GS82583EQ36GK-500
  • ECCN
    3A991.B.2.B
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B260
  • Memory Width
    36
  • Package Code
    HBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    QDR SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Memory Organization
    8MX36
  • Number of Functions
    1
  • Number of Terminals
    260
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    8M
  • Memory Density (bits)
    301989888
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.3
  • Supply Voltage-Max (V)
    1.35
  • Supply Voltage-Min (V)
    1.25
  • Supply Voltage-Nom (V)
    1.3
  • Number of Words (words)
    8388608
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0

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GS82583EQ36GK-500
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GS82583EQ36GK-500