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GS82583ED18GK-550I

GSI Technology, Inc.

GSI Technology, Inc. GS82583ED18GK-550I
  • ECCN
    3A991.B.2.B
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B260
  • Memory Width
    18
  • Package Code
    HBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Memory IC Type
    QDR SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Terminal Position
    BOTTOM
  • Memory Organization
    16MX18
  • Number of Functions
    1
  • Number of Terminals
    260
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    16M
  • Memory Density (bits)
    301989888
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.3
  • Supply Voltage-Max (V)
    1.25
  • Supply Voltage-Min (V)
    1.15
  • Supply Voltage-Nom (V)
    1.2
  • Number of Words (words)
    16777216

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GS82583ED18GK-550I
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GS82583ED18GK-550I