GS8170DD36AC-333 by GSI Technology, Inc. | Sourcengine

GSI Technology, Inc. GS8170DD36AC-333

Lifecycle status
Active-Unconfirmed
REACH
REACH compliant
Description
Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209
Category
Semiconductors Memory ICs SRAMs STANDARD SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
Width (mm)
14
Length (mm)
22
JESD-30 Code
R-PBGA-B209
Memory Width
36
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
STANDARD SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
PIPE LINED ARCHITECTURE
Memory Organization
512KX36
Number of Functions
1
Number of Terminals
209
Terminal Pitch (mm)
1
Access Time-Max (ns)
1.8
Number of Words Code
512K
Memory Density (bits)
18874368
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
1.95
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
524288
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0