GS8170D18B-250IT by GSI Technology, Inc. | Sourcengine

GSI Technology, Inc. GS8170D18B-250IT

Lifecycle status
Discontinued
REACH
REACH compliant
Description
Standard SRAM, 1MX18, 2.1ns, CMOS, PBGA209
Category
Semiconductors Memory ICs SRAMs STANDARD SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
14
Length (mm)
22
JESD-30 Code
R-PBGA-B209
Memory Width
18
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
STANDARD SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Additional Feature
PIPELINED ARCHITECTURE
Memory Organization
1MX18
Number of Functions
1
Number of Terminals
209
Terminal Pitch (mm)
1
Access Time-Max (ns)
2.1
Number of Words Code
1M
Memory Density (bits)
18874368
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.7
Supply Voltage-Max (V)
1.95
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
1048576
Standby Voltage-Min (V)
1.7
Package Equivalence Code
BGA209,11X19,40
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40