ProductsManufacturers
Events
Send an RFQBOM Tool

GS8162Z18DGB-400

GSI Technology, Inc.

GSI Technology, Inc. GS8162Z18DGB-400
  • ECCN
    3A991.B.2.B
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    22
  • JESD-30 Code
    R-PBGA-B119
  • Memory Width
    18
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    ZBT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
  • Memory Organization
    1MX18
  • Number of Functions
    1
  • Number of Terminals
    119
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    4
  • Number of Words Code
    1M
  • Memory Density (bits)
    18874368
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.99
  • Supply Voltage-Max (V)
    2.7
  • Supply Voltage-Min (V)
    2.3
  • Supply Voltage-Nom (V)
    2.5
  • Number of Words (words)
    1048576
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for GS8162Z18DGB-400

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
GS8162Z18DGB-400
Send an RFQ
GS8162Z18DGB-400