GS81302R18E-250

GSI Technology, Inc.

GSI Technology, Inc. GS81302R18E-250
  • ECCN
    3A991.B.2.B
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    15 mm
  • Length
    17 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B165
  • Memory Width
    18
  • Organization
    8MX18
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    150994944 bit
  • Memory IC Type
    DDR II SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    0.45 ns
  • Number of Words
    8388608 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    1.5 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Number of Functions
    1
  • Number of Terminals
    165
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for GS81302R18E-250

Send an RFQ

Your RFQ will be directly sent to our expert: Ayesha

Send an RFQ
GS81302R18E-250
Send an RFQ
GS81302R18E-250