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GM23C32000-12

LG SEMICON CO LTD

LG SEMICON CO LTD GM23C32000-12
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T42
  • Memory Width
    16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    MASK ROM
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    2MX16
  • Number of Terminals
    42
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    120
  • Number of Words Code
    2M
  • Memory Density (bits)
    33554432
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    60
  • Package Equivalence Code
    DIP42,.6
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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GM23C32000-12
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GM23C32000-12