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GDPXA250B1E400

Intel Corporation

Intel Corporation GDPXA250B1E400
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Format
    FIXED POINT
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • Speed (MHz)
    400
  • JESD-30 Code
    S-PBGA-B256
  • Package Code
    HBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Integrated Cache
    YES
  • Address Bus Width
    26
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA256,16X16,40
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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GDPXA250B1E400
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GDPXA250B1E400