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FTE768KX8HTN3-25

FORCE TECHNOLOGIES LTD

FORCE TECHNOLOGIES LTD FTE768KX8HTN3-25
  • ECCN
    3A001.a.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    15.24
  • JESD-30 Code
    R-CDIP-T36
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    768KX8
  • Number of Functions
    1
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    250
  • Number of Words Code
    768K
  • Memory Density (bits)
    6291456
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    8.89
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    786432
  • Programming Voltage (V)
    5
  • Operating Temperature-Max (Cel)
    175
  • Operating Temperature-Min (Cel)
    -55
  • Write Cycle Time-Max (tWC) (ms)
    10

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FTE768KX8HTN3-25