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FQV7260L6BB

AMIC TECHNOLOGY CORP

AMIC TECHNOLOGY CORP FQV7260L6BB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B256
  • Memory Width
    72
  • Package Code
    BGA
  • Output Enable
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    OTHER FIFO
  • Operating Mode
    SYNCHRONOUS
  • Cycle Time (ns)
    6
  • Parallel/Serial
    PARALLEL/SERIAL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    4KX72
  • Number of Functions
    1
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Access Time-Max (ns)
    4
  • Number of Words Code
    4K
  • Memory Density (bits)
    294912
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    3.3
  • Number of Words (words)
    4096
  • Standby Current-Max (A)
    0.015
  • Supply Current-Max (mA)
    40
  • Package Equivalence Code
    BGA256,16X16,40
  • Clock Frequency-Max (MHz)
    166
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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FQV7260L6BB