ProductsManufacturers
Events
Send an RFQBOM Tool

FE2864-250

SEEQ TECHNOLOGY INC

SEEQ TECHNOLOGY INC FE2864-250
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Endurance
    10000 Write/Erase Cycles
  • Ready/Busy
    YES
  • Technology
    MOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-XDFP-F28
  • Memory Width
    8
  • Organization
    8KX8
  • Package Code
    DFP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    65536 bit
  • Memory IC Type
    EEPROM
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    250 ns
  • Number of Words
    8192 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    120 mA
  • Number of Terminals
    28
  • Number of Words Code
    8K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Command User Interface
    NO
  • Package Equivalence Code
    FL28,.4
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Write Cycle Time-Max (tWC)
    10 ms

0 suppliers available to buy or to bid for FE2864-250

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
FE2864-250
Send an RFQ
FE2864-250