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F9451GC-MSP

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP F9451GC-MSP
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Terminal Position
    DUAL
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    SO(UNSPEC)
  • uPs/uCs/Peripheral ICs Type
    MEMORY MANAGEMENT UNIT
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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F9451GC-MSP
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F9451GC-MSP