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F9451DMQB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP F9451DMQB
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Package Code
    DIP
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    DIP(UNSPEC)
  • uPs/uCs/Peripheral ICs Type
    MEMORY MANAGEMENT UNIT
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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F9451DMQB
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F9451DMQB