ProductsManufacturers
Events
Send an RFQBOM Tool

F9451DC-MSP

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP F9451DC-MSP
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Package Code
    DIP
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Terminal Position
    DUAL
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Package Equivalence Code
    DIP(UNSPEC)
  • uPs/uCs/Peripheral ICs Type
    MEMORY MANAGEMENT UNIT
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

0 suppliers available to buy or to bid for F9451DC-MSP

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
F9451DC-MSP
Send an RFQ
F9451DC-MSP