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F82C212-16

CHIPS AND TECHNOLOGIES INC

CHIPS AND TECHNOLOGIES INC F82C212-16
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • JESD-30 Code
    R-PQFP-G100
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    75
  • Package Equivalence Code
    QFP100,.7X1.0
  • uPs/uCs/Peripheral ICs Type
    MEMORY CONTROLLER, DRAM
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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F82C212-16
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F82C212-16