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EPM7512AEBC256-12N

Intel Corporation

Intel Corporation EPM7512AEBC256-12N
  • ECCN
    3A991.d
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B256
  • Organization
    0 DEDICATED INPUTS, 212 I/O
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Output Function
    MACROCELL
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3
  • Number of I/O Lines
    212
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    5.5
  • Seated Height-Max (mm)
    2.3
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Programmable Logic Type
    EE PLD
  • Clock Frequency-Max (MHz)
    163.9
  • Number of Dedicated Inputs
    0
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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EPM7512AEBC256-12N
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EPM7512AEBC256-12N