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EPF6016AFI100-3N

Intel Corporation

Intel Corporation EPF6016AFI100-3N
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.55
  • JTAG BST
    YES
  • Width (mm)
    11
  • Length (mm)
    11
  • Architecture
    PLA-TYPE
  • JESD-30 Code
    S-PBGA-B100
  • Organization
    4 DEDICATED INPUTS, 81 I/O
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Output Function
    MACROCELL
  • Number of Inputs
    81
  • Number of Outputs
    81
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    81
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    YES
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    3
  • Supply Voltage-Nom (V)
    3.3
  • Programmable Logic Type
    LOADABLE PLD
  • Package Equivalence Code
    BGA100,10X10,40
  • Clock Frequency-Max (MHz)
    588.23
  • Number of Dedicated Inputs
    4
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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EPF6016AFI100-3N
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EPF6016AFI100-3N